PRODUCTS
Power Devic
Evaluation Equipment
At Headspring we have been observing the trend in market, and being very close to Semi-conductor Industry,We are introducing to the world the Semi-Conductor evaluation machines for to do the reliabliltiy testing for your power Semi conductor moduels.
IGBT Power Cycle Test System
| Applicable components |
Applicable components packing | SiC compatible |
|---|---|---|
| For Si/SiC second-level power cycling (PCsec) and minute-level power cycling (PCmin) for IGBT/DIODE/MOSFET devices | MODULE:HPD/DSC/SSC/TPARK/Econopack/62mm/34mm/Easy, etc. Customization of development is acceptable. | Compatible |
High Temperature High Humidity Reverse Bias Burn-In Test System
| Applicable components |
Applicable components packing | SiC compatible |
|---|---|---|
| For MOSFET,IGBT, diode, triode, IGBT module, PIM module, IPM module | DISCRETE DEVICE: TO-247-3L/TO-247-4L/TOLL/DFN5/DIP/H2PAK/PDFN/SOP/SOT/TO-220/TO-252/TO-263/TSSOP/SMA/SMB/SMC/SMD, etc. Customization of development is acceptable. MODULE： HPD/DSC/SSC/TPARK/Econopack/62mm/34mm/Easy, etc. Customization of development is acceptable. |
Compatible |
High Temperature Gate Bias Burn-In Test System
| Applicable components |
Applicable components packing | SiC compatible |
|---|---|---|
| For MOSFET, IGBT, diode, IGBT module | DISCRETE DEVICE： TO-247-3L/TO-247-4L/TOLL/ DFN5/DIP/H2PAK/PDFN/SOP/SOT/TO-220/TO-252/TO-263/TSSOP/ SMA/SMB/SMC/SMD, etc. Customization of development is acceptable. MODULE： HPD/DSC/SSC/TPARK/Econopack/62mm/34mm/Easy, etc. Customization of development is acceptable. |
Compatible |
High Temperature Reverse Bias Burn-In Test System
| Applicable components |
Applicable components packing | SiC compatible |
|---|---|---|
| For MOSFET IGBT, diode, triode, IGBT module, PIM module, IPM module | DISCRETE DEVICE： TO-247-3L/TO-247-4L/TOLL/ DFN5/DIP/H2PAK/PDFN/SOP/SOT/TO-220/TO-252/TO-263/ TSSOP/SMA/SMB/SMC/SMD, etc. Customization of development is acceptable. MODULE： HPD/DSC/SSC/TPARK/Econopack/62mm/34mm/Easy, etc. Customization of development is acceptable. |
Compatible |
Large Scale Integrated Circuit burn-in test system
| Applicable components |
Applicable components packing | SiC compatible |
|---|---|---|
| For large-scale integrated circuits such as memory, CPU, FPGA, and DSP | For a variety of packages, including DP, Thorpe, Buga, Pujia, Fupp, Poulk, Lake, etc. | Incompatible |
Strong Points
- 1)Service available at a reliable cost and all around support (Headsrping will soon have its office in India),
- 2) As our power supplies, are used in this equippment for charging.
- 3) Our one package Jig will cover all brands sizes of Power Semi conductor moduels.
Please Contact our dealers for pricing and more information about this product